Items where Author is "Mok, P. L."

Export as [feed] RSS 1.0 [feed] RSS 2.0
Group by: Date | Item Type | Title | No Grouping
Jump to: 2002
Number of items: 1.


Ku, H. S. and Siu, F. and Mok, P. L. and Siores, E. and Ball, J. A. R. (2002) Characterisation of chip-on-board (COB) encapsulate epoxies used in the printed circuit board assembly (PCBA) industry using variable frequency microwave (VFM) facilities. In: 2nd World Engineering Congress (WEC 2002), 22-25 Jul 2002, Sarawak, Malaysia.

This list was generated on Mon Mar 30 23:58:20 2020 AEST.