Items where Author is "Mok, P. L."

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2002

Ku, H. S. and Siu, F. and Mok, P. L. and Siores, E. and Ball, J. A. R. (2002) Characterisation of chip-on-board (COB) encapsulate epoxies used in the printed circuit board assembly (PCBA) industry using variable frequency microwave (VFM) facilities. In: 2nd World Engineering Congress (WEC 2002), 22-25 Jul 2002, Sarawak, Malaysia.

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