Items where Author is "Ball, J. A. R."

2011

Shahid, S. and Ball, J. A. R. and Wells, C. G. and Wen, P. ORCID: https://orcid.org/0000-0003-0939-9145 (2011) Reflection type Q-factor measurement using standard least squares methods. IET Microwaves, Antennas and Propogation, 5 (4). pp. 426-432. ISSN 1751-8725

2009

Sharma, R. and Ball, J. A. R. (2009) Unipolar stitched inverter low-frequency harmonics caused by stitching delay. IET Power Electronics, 2 (5). pp. 508-516. ISSN 1755-4535

2003

Ku, H. S. and Siu, F. and Siores, E. and Ball, J. A. R. (2003) Variable frequency microwave (VFM) processing facilities and application in processing thermoplastic matrix composites. Journal of Materials Processing Technology, 139 (1-3). pp. 291-295. ISSN 0924-0136

2002

Ku, H. S. and Siu, F. and Siores, E. and Ball, J. A. R. (2002) Applications of fixed and variable frequency microwave (VFM) facilities in polymeric materials processing and joining. In: 2nd World Engineering Congress (WEC 2002), 22-25 Jul 2002, Kuching, Malaysia.

Ku, H. S. and Siu, F. and Mok, P. L. and Siores, E. and Ball, J. A. R. (2002) Characterisation of chip-on-board (COB) encapsulate epoxies used in the printed circuit board assembly (PCBA) industry using variable frequency microwave (VFM) facilities. In: 2nd World Engineering Congress (WEC 2002), 22-25 Jul 2002, Sarawak, Malaysia.

2001

Ku, H. S. and Siu, F. and Siores, E. and Ball, J. A. R. and Blicblau, A. S. (2001) Applications of fixed and variable frequency microwave (VFM) facilities in polymeric materials processing and joining. In: 5th Asia Pacific Conference on Materials Processing, 25 Jun 2001, Seoul, Korea.

Ku, H. S. and Siu, F. and Siores, E. and Ball, J. A. R. (2001) Applications of microwaves in non-destructive testing. In: 10th Asia Pacific Conference on Non-Destructive Testing (2001), 17-21 Sep 2001, Brisbane, Australia.

2000

Ku, H. S. and Ball, J. A. R. and Siores, E. (2000) Relationship between microwave irradiation and constituents of composites during joining process. Transactions Hong Kong Institution of Engineers , 7 (3). pp. 43-49. ISSN 1023-697X