AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP)

Zhou, Yan and Pan, Guoshun and Shi, Xiaolei ORCID: https://orcid.org/0000-0003-0905-2547 and Gong, Hua and Xu, Li and Zou, Chunli (2015) AFM and XPS studies on material removal mechanism of sapphire wafer during chemical mechanical polishing (CMP). Journal of Materials Science: Materials in Electronics, 26 (12). pp. 9921-9928. ISSN 0957-4522


Abstract

The material removal mechanism of sapphire wafer during chemical mechanical polishing has been studied through X-ray photoelectron spectroscopy (XPS) and atomic force microscopy (AFM) measurements. XPS results indicate that alumina silicate (Al2Si2O7·2H2O) is generated on the polished sapphire surface by SiO2 slurry, otherwise alumina hydrate (AlO(OH)) on the polished surface by H2O solution. Meanwhile, ultra-smooth polished surface with extremely low Ra of below 0.1 nm and atomic step structure morphology via AFM is realized using SiO2 slurry. Through investigating the variations of the surface characteristics polished by different ingredients via the morphology and force curve measurements, it’s reveals that the product-aluminum silicate with stronger adhesion and lower hardness is more readily to generate and be removed than the product-alumina hydrate induced by H2O. Thus, except for atomic scale mechanical abrading, the abrasive SiO2 nanoparticle is used for anticipating in the chemical reaction, resulting in superior surface finish of sapphire wafer with high efficiency.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Faculty/School / Institute/Centre: No Faculty
Faculty/School / Institute/Centre: No Faculty
Date Deposited: 14 Oct 2020 01:37
Last Modified: 02 Nov 2020 05:12
Uncontrolled Keywords: Atomic Force Microscopy; Sapphire; Material Removal Rate; Chemical Mechanical Polishing; Atomic Step
Fields of Research (2008): 09 Engineering > 0912 Materials Engineering > 091299 Materials Engineering not elsewhere classified
Fields of Research (2020): 40 ENGINEERING > 4016 Materials engineering > 401699 Materials engineering not elsewhere classified
Identification Number or DOI: https://doi.org/10.1007/s10854-015-3668-x
URI: http://eprints.usq.edu.au/id/eprint/39889

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