Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface

Pan, Guoshun and Zhou, Yan and Luo, Guihai and Shi, Xiaolei ORCID: and Zou, Chunli and Gong, Hua (2013) Chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer for obtaining atomically flat defect-free surface. Journal of Materials Science: Materials in Electronics, 24 (12). pp. 5040-5047. ISSN 0957-4522


Due to its high mechanical hardness and excellent chemical inertness, SiC single-crystal wafer is extremely difficult to realize effectively removed total planarization. Owing to crystalline polarity and anisotropy, material removal rate (MRR) on Si-face (0001) of SiC wafer is significantly lower than C-face (0001¯) for a defect-free surface. In the paper, the slurry containing hydrogen peroxide (H2O2), potassium hydroxide and abrasive colloidal silica, is introduced to chemical mechanical polishing (CMP) of on-axis Si-face 6H-SiC wafer, resulting in acquiring high MRR with 105 nm/h, and atomically flat defect-free surface with atomic step-terrace structure and roughness of 0.0667 nm by atomic force microscope (AFM), in order to satisfy further demands of electronic device fabrication towards substrate wafer performance. The effects of the three ingredients in the slurry towards MRR of SiC wafer, polished surface quality and coefficient of friction in polishing process are studied. Optical microscope, optical interferometry profiler and AFM are used to observe the polished surface. In addition, the CMP removal mechanism of SiC wafer and the formation of ultra-smooth surface are discussed.

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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: Permanent restricted access to Published version in accordance with the copyright policy of the publisher.
Faculty/School / Institute/Centre: No Faculty
Faculty/School / Institute/Centre: No Faculty
Date Deposited: 16 Sep 2020 01:39
Last Modified: 16 Sep 2020 02:58
Fields of Research (2008): 09 Engineering > 0912 Materials Engineering > 091205 Functional Materials
Fields of Research (2020): 40 ENGINEERING > 4016 Materials engineering > 401605 Functional materials
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