Investigation of the chemical residuals on the fused silica during chemical mechanical polishing

Xu, Li and Chen, Gaopan and Luo, Haimei and Shi, Xiao-Lei ORCID: https://orcid.org/0000-0003-0905-2547 and Luo, Guihai and Pan, Guoshun (2018) Investigation of the chemical residuals on the fused silica during chemical mechanical polishing. ChemistrySelect, 3 (31). pp. 8930-8935.

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Abstract

Chemical residuals on fused silica after chemical mechanical polishing with silica and ceria have been analyzed. The surface of fused silica terminates with silanol after being polished with silica abrasives but ends up with Ce‐O−Si in a ceria‐based slurry under the CMP environment. The silanol firstly synthesizes on a fused silica surface polished with ceria, but then further reacts with hydroxyl cerium groups scattering in the slurry forming Ce‐O−Si. It also reveals that polishing fused silica with silica abrasives is an alternative way giving an ultra smooth surface.

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Item Type:	Article (Commonwealth Reporting Category C)
Refereed:	Yes
Item Status:	Live Archive
Additional Information:	Files associated with this item cannot be displayed due to copyright restrictions.
Faculty/School / Institute/Centre:	Current - Institute for Advanced Engineering and Space Sciences - Centre for Future Materials (1 Jan 2017 -)
Faculty/School / Institute/Centre:	Current - Institute for Advanced Engineering and Space Sciences - Centre for Future Materials (1 Jan 2017 -)
Date Deposited:	24 Jul 2020 00:28
Last Modified:	11 Sep 2020 02:45
Uncontrolled Keywords:	Fused silica; Chemical Mechanical Polishing; Chemical Products; Material Removal Mechanism
Fields of Research (2008):	09 Engineering > 0912 Materials Engineering > 091205 Functional Materials
Identification Number or DOI:	https://doi.org/10.1002/slct.201801163
URI:	http://eprints.usq.edu.au/id/eprint/38902

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