Shi, Xiao-Lei ORCID: https://orcid.org/0000-0003-0905-2547 and Xu, Li and Zhou, Yan and Zou, Chunli and Wang, Rongrong and Pan, Guoshun
(2018)
An in situ study of chemical-mechanical polishing behaviours on sapphire (0001) via simulating the chemical product-removal process by AFM-tapping mode in both liquid and air environments.
Nanoscale, 10 (42).
pp. 19692-19700.
ISSN 2040-3364
Abstract
Chemical-mechanical polishing (CMP) has drawn significant attention as one of the most advanced techniques for achieving an atomic-level smooth surface. However, the mechanism of CMP is still unclear, and the in situ characterization of CMP behaviors at the nanoscale has been a challenge for decades. In this study, we, for the first time, report an in situ study of CMP behaviors on sapphire (0001) via simulating the chemical product-removal process by using atomic force microscopy (AFM) in tapping mode. Through a combination of intensive experimental measurements and detailed structural characterizations, it is shown that the AFM probe in tapping mode can act as a polishing abrasive to realize simultaneous imaging and chemical product removal on sapphire (0001), thus achieving successful in situ characterizations in both liquid and air environments. This work fills in gaps relating to fundamental CMP mechanisms, and provides a new perspective for the study of CMP behaviors on different materials.
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Item Type: | Article (Commonwealth Reporting Category C) |
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Refereed: | Yes |
Item Status: | Live Archive |
Additional Information: | Files associated with this item cannot be displayed due to copyright restrictions. |
Faculty/School / Institute/Centre: | Current - Institute for Advanced Engineering and Space Sciences - Centre for Future Materials (1 Jan 2017 -) |
Faculty/School / Institute/Centre: | Current - Institute for Advanced Engineering and Space Sciences - Centre for Future Materials (1 Jan 2017 -) |
Date Deposited: | 24 Jul 2020 00:09 |
Last Modified: | 11 Sep 2020 02:45 |
Uncontrolled Keywords: | Atomic-force-microscope; different sizes; cmp; slurry; wafer; spectroscopy; performance; substrate; silica; images |
Fields of Research (2008): | 09 Engineering > 0912 Materials Engineering > 091205 Functional Materials |
Identification Number or DOI: | https://doi.org/10.1039/c8nr04645j |
URI: | http://eprints.usq.edu.au/id/eprint/38901 |
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