Dinh, Toan 
ORCID: https://orcid.org/0000-0002-7489-9640 and Phan, Hoang-Phuong and Kozeki, Takahiro and Qamar, Afzaal and Namazu, Takahiro and Nguyen, Nam-Trung and Dao, Dzung Viet
(2015)
Thermoresistive properties of p-type 3C-SiC nanoscale thin films for high-temperature MEMS thermal-based sensors.
RSC Advances, 5 (128).
pp. 106083-106086.
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Text (Published Version)
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Abstract
We report for the first time the thermoresistive property of p-type single crystalline 3C-SiC (p-3C-SiC), which was epitaxially grown on a silicon (Si) wafer, and then transferred to a glass substrate using a Focused Ion Beam (FIB) technique. A negative and relatively large temperature coefficient of resistance (TCR) up to -5500 ppm K-1 was observed. This TCR is attributed to two activation energy thresholds of 45meV and 52 meV, corresponding to temperatures below and above 450 K, respectively, and a small reduction of hole mobility with increasing temperature. The large TCR indicates the suitability of p-3C-SiC for thermal-based sensors working in high-temperature environments.
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| Item Type: | Article (Commonwealth Reporting Category C) |
|---|---|
| Refereed: | Yes |
| Item Status: | Live Archive |
| Additional Information: | Published version deposited in accordance with the copyright policy of the publisher. |
| Faculty/School / Institute/Centre: | No Faculty |
| Faculty/School / Institute/Centre: | No Faculty |
| Date Deposited: | 17 Mar 2020 02:11 |
| Last Modified: | 20 Mar 2020 04:59 |
| Uncontrolled Keywords: | sensors, stresses, stress sensors, activation energy, epitaxial growth, hole mobility, ion beams, silicon carbide, silicon wafers, substrates |
| Fields of Research (2008): | 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS) 02 Physical Sciences > 0203 Classical Physics > 020399 Classical Physics not elsewhere classified |
| Socio-Economic Objectives (2008): | E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering |
| Identification Number or DOI: | https://doi.org/10.1039/c5ra20289b |
| URI: | http://eprints.usq.edu.au/id/eprint/38232 |
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