The dependence of offset voltage in p-type 3C-SiC van der Pauw device on applied strain

Qamar, Afzaal and Phan, Hoang-Phuong and Dao, Dzung Viet and Tanner, Philip and Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Wang, Li and Dimitrijev, Sima (2015) The dependence of offset voltage in p-type 3C-SiC van der Pauw device on applied strain. IEEE Electron Device Letters, 36 (7):7110537. pp. 708-710. ISSN 0741-3106


Abstract

This letter reports for the first time the strain dependence of the offset voltage in p-type 3C-SiC van der Pauw square device. The p-type 3C-SiC thin film was epitaxially grown on a p-type Si(100) wafer using low pressure chemical vapor deposition followed by a conventional photolithography and dry etch processes, forming four-terminal van der Pauw device. The influence of applied tensile and compressive strain on the offset voltage of the van der Pauw device was investigated using the bending beam method. Experimental results showed that the offset voltage of the device is significantly changed by applied compressive and tensile strain, indicating the feasibility of using this effect for mechanical sensing applications. The sensitivity of the device to the applied strain has been found to be 70 (mV/A)/ppm


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: Permanent restricted access to Published version, in accordance with the copyright policy of the publisher.
Faculty/School / Institute/Centre: No Faculty
Faculty/School / Institute/Centre: No Faculty
Date Deposited: 01 May 2020 04:42
Last Modified: 01 May 2020 04:42
Uncontrolled Keywords: p-type 3C-SiC, van der Pauw device, strain sensor
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
09 Engineering > 0906 Electrical and Electronic Engineering > 090699 Electrical and Electronic Engineering not elsewhere classified
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering
Identification Number or DOI: https://doi.org/10.1109/LED.2015.2435153
URI: http://eprints.usq.edu.au/id/eprint/38229

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