Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching

Phan, Hoang-Phuong and Kozeki, Takahiro and Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Fujii, Tatsuya and Qamar, Afzaa and Zhu, Yong and Namazu, Takahiro and Nguyen, Nam-Trung and Dao, Dzung Viet (2015) Piezoresistive effect of p-type silicon nanowires fabricated by a top-down process using FIB implantation and wet etching. RSC Advances, 5 (100). pp. 82121-82126.

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The piezoresistive effect in silicon nanowires (SiNWs) has attracted a great deal of interest for NEMS devices. Most of the piezoresistive SiNWs reported in the literature were fabricated using the bottom up method or top down processes such as electron beam lithography (EBL). Focused ion beam (FIB), on the other hand, is more compatible with CMOS integration than the bottom up method, and is simpler and more capable of fabricating very narrow Si nanostructures compared to EBL and photolithography. Taking the advantages of FIB, this paper presents for the first time the piezoresistive effect of p-type SiNWs fabricated using focused ion beam implantation and wet etching. The SiNWs were locally amorphized by Ga+ ion implantation, selectively wet-etched, and thermally annealed at 700 °C. A relatively large gauge factor of approximately 47 was found in the annealed SiNWs, indicating the potential of using the piezoresistive effect in top-down fabricated SiNWs for developing NEMS sensors.

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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: Published version deposited in accordance with the copyright policy of the publisher.
Faculty/School / Institute/Centre: No Faculty
Faculty/School / Institute/Centre: No Faculty
Date Deposited: 25 Jun 2020 04:42
Last Modified: 25 Jun 2020 05:01
Uncontrolled Keywords: focused ion beams
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Fields of Research (2020): 40 ENGINEERING > 4017 Mechanical engineering > 401705 Microelectromechanical systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering
Identification Number or DOI: https://doi.org/10.1039/c5ra13425k
URI: http://eprints.usq.edu.au/id/eprint/38227

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