High thermosensitivity of silicon nanowires induced by amorphization

Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Phan, Hoang-Phuong and Kozehi, Takahiro and Qamar, Afzaal and Fujii, Tatsuya and Namazu, Takahiro and Nguyen, Nam-Trung and Dao, Dzung Viet (2016) High thermosensitivity of silicon nanowires induced by amorphization. Materials Letters, 177. pp. 80-84. ISSN 0167-577X


Abstract

In this work, we demonstrate highly thermosensitive silicon nanowires (SiNWs) for thermal-sensing applications. Crystalline Si was amorphized by Focused Ion Beam in the fabrication process of the SiNWs, and subsequently recrystallized by a thermal annealing process to improve their electrical conductivity. A temperature coefficient of resistance (TCR) from −8000 ppm/K to −12,000 ppm/K was measured for the SiNWs. This large negative TCR is attributed to the boundary potential barrier of 110 meV between silicon crystallites in the poly crystalline SiNWs.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Date Deposited: 12 Aug 2020 23:38
Last Modified: 11 Sep 2020 00:53
Uncontrolled Keywords: Thermoresistive effect; Temperature coefficient of resistance; Silicon nanowire; Amorphization; Focused ion beam
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Fields of Research (2020): 40 ENGINEERING > 4017 Mechanical engineering > 401705 Microelectromechanical systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970102 Expanding Knowledge in the Physical Sciences
Identification Number or DOI: https://doi.org/10.1016/j.matlet.2016.04.171
URI: http://eprints.usq.edu.au/id/eprint/38214

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