Single-crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high-temperature electronics and bioapplications

Phan, Hoang-Phuong and Cheng, Han-Hao and Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Wood, Barry and Nguyen, Tuan-Khoa and Mu, Fengwen and Kamble, Harshad and Vadivelu, Raja and Walker, Glenn and Hold, Leonie and Iacopi, Alan and Haylock, Ben and Dao, Dzung Viet and Lobino, Mirko and Suga, Tadatomo and Nguyen, Nam-Trung (2017) Single-crystalline 3C-SiC anodically bonded onto glass: an excellent platform for high-temperature electronics and bioapplications. ACS Applied Materials and Interfaces, 9 (23). pp. 27365-27371. ISSN 1944-8244


Abstract

Single-crystal cubic silicon carbide has attracted great attention for MEMS and electronic devices. However, current leakage at the SiC/Si junction at high temperatures and visible-light absorption of the Si substrate are main obstacles hindering the use of the platform in a broad range of applications. To solve these bottlenecks, we present a new platform of single crystal SiC on an electrically insulating and transparent substrate using an anodic bonding process. The SiC thin film was prepared on a 150 mm Si with a surface roughness of 7 nm using LPCVD. The SiC/Si wafer was bonded to a glass substrate and then the Si layer was completely removed through wafer polishing and wet etching. The bonded SiC/glass samples show a sharp bonding interface of less than 15 nm characterized using deep profile X-ray photoelectron spectroscopy, a strong bonding strength of approximately 20 MPa measured from the pulling test, and relatively high optical transparency in the visible range. The transferred SiC film also exhibited good conductivity and a relatively high temperature coefficient of resistance varying from −12 000 to −20 000 ppm/K, which is desirable for thermal sensors. The biocompatibility of SiC/glass was also confirmed through mouse 3T3 fibroblasts cell-culturing experiments. Taking advantage of the superior electrical properties and biocompatibility of SiC, the developed SiC-on-glass platform offers unprecedented potentials for high-temperature electronics as well as bioapplications.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: Files associated with this item cannot be displayed due to copyright restrictions.
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Date Deposited: 07 Aug 2020 00:17
Last Modified: 11 Sep 2020 01:04
Uncontrolled Keywords: ilicon carbide; anodic bonding; MEMS; harsh environment electronics; bioapplications
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Fields of Research (2020): 40 ENGINEERING > 4017 Mechanical engineering > 401705 Microelectromechanical systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970102 Expanding Knowledge in the Physical Sciences
Identification Number or DOI: https://doi.org/10.1021/acsami.7b06661
URI: http://eprints.usq.edu.au/id/eprint/38202

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