Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures

Phan, Hoang-Phuong and Dowling, Karen M. and Nguyen, Tuan-Khoa and Chapin, Caitlin A. and Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Miller, Ruth A. and Han, Jisheng and Iacopi, Alan and Senesky, Debbie G. and Dao, Dzung Viet and Nguyen, Nam-Trung (2018) Characterization of the piezoresistance in highly doped p-type 3C-SiC at cryogenic temperatures. RSC Advances, 8 (52). pp. 29976-29979.

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Abstract

This paper reports on the piezoresistive effect in p-type 3C-SiC thin film mechanical sensing at cryogenic conditions. Nanothin 3C-SiC films with a carrier concentration of 2 × 1019 cm-3 were epitaxially grown on a Si substrate using the LPCVD process, followed by photolithography and UV laser engraving processes to form SiC-on-Si pressure sensors. The magnitude of the piezoresistive effect was measured by monitoring the change of the SiC conductance subjected to pressurizing/depressurizing cycles at different temperatures. Experimental results showed a relatively stable piezoresistive effect in the highly doped 3C-SiC film with the gauge factor slightly increased by 20% at 150 K with respect to that at room temperature. The data was also in good agreement with theoretical analysis obtained based on the charge transfer phenomenon. This finding demonstrates the potential of 3C-SiC for MEMS sensors used in a large range of temperatures from cryogenic to high temperatures.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: This article is licensed under a Creative Commons Attribution-NonCommercial 3.0 Unported Licence.
Faculty/School / Institute/Centre: No Faculty
Faculty/School / Institute/Centre: No Faculty
Date Deposited: 26 May 2020 04:41
Last Modified: 03 Jun 2020 04:44
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Fields of Research (2020): 40 ENGINEERING > 4017 Mechanical engineering > 401705 Microelectromechanical systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering
Identification Number or DOI: https://doi.org/10.1039/c8ra05797d
URI: http://eprints.usq.edu.au/id/eprint/38169

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