An on-chip SiC MEMS device with integrated heating, sensing, and microfluidic cooling systems

Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Phan, Hoang-Phuong and Kashaninejad, Navid and Nguyen, Tuan-Khoa and Dao, Dzung Viet and Nguyen, Nam-Trung (2018) An on-chip SiC MEMS device with integrated heating, sensing, and microfluidic cooling systems. Advanced Materials Interfaces, 5 (20):1800764.

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Abstract

There has been increasing interest in electronic systems with integrated microfluidic active cooling modules. However, the failure of 3C‐SiC/Si interface with increasing temperature has prevented the development of 3C‐SiC power electronic devices. Here, all integrated transparent heating, sensing, and cooling systems are developed on a single silicon carbide (SiC) chip for efficient thermal management. SiC nanofilms are grown on a silicon wafer, are transferred to a glass substrate, and then a micro electromechanical system process is employed to fabricate a SiC‐on‐glass system with integrated heaters and temperature sensors. A cooling system is fabricated with microchannel using 3D printing, molding, and plasma assisted bonding. The thermal management of the SiC‐based system shows an excellent capability of heating and detecting temperature as well as effective cooling with an efficiency of from 0.24 to 0.28 and a maximum cooling rate of 0.1 K(µL min−1)−1. The fabrication strategy can be utilized for large production of SiC power nanoelectronics with high efficiency of integrated thermal management systems.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Date Deposited: 30 Jul 2020 00:16
Last Modified: 11 Sep 2020 02:34
Uncontrolled Keywords: microfluidic cooling; power electronics; SiC MEMS; SiC; Si heterostructure; thermoresistive effect
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering
Identification Number or DOI: https://doi.org/10.1002/admi.201800764
URI: http://eprints.usq.edu.au/id/eprint/38167

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