Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling

Phan, Hoang-Phuong and Nguyen, Tuan-Khoa and Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Qamar, Afzaal and Iacopi, Alan and Lu, Junwei and Dao, Dzung Viet and Rais-Zadeh, Mina and Nguyen, Nam-Trung (2019) Wireless battery-free SiC sensors operating in harsh environments using resonant inductive coupling. IEEE Electron Device Letters, 40 (4). pp. 609-612. ISSN 0741-3106


Abstract

Silicon carbide (SiC) has been extensively investigated in the last decade, specifically for applications in harsh environments. However, most SiC sensors require an external power supply, which cannot operate at high temperatures. This letter develops a new sensing technology in a SiC platform based on near field communication to eliminate the requirement for wired power sources. The 3C-SiC temperature sensors were fabricated from a SiC-on-insulator substrate formed by anodic bonding. The sensors functioned based on the thermoresistance of the SiC films with the high TCR of -13 000 ppm/K at 300 K and -3 000 ppm/K at 600 K. The resistance change of the sensors was wirelessly measured using a reading coil placed outside of the heating chamber, showing a significant resonant-frequency-shift (-400 ppm/K at 600 K) of the coupling impedance under temperature variation. The proposed technique is promising for the development of wireless wide-band-gap sensors used in extreme conditions.


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Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Date Deposited: 17 Jul 2020 05:21
Last Modified: 20 Jul 2020 03:24
Uncontrolled Keywords: Temperature sensors; Silicon carbide; Temperature measurement; Wireless communication; Resonant frequency; Silicon
Fields of Research (2008): 09 Engineering > 0913 Mechanical Engineering > 091306 Microelectromechanical Systems (MEMS)
Fields of Research (2020): 40 ENGINEERING > 4017 Mechanical engineering > 401705 Microelectromechanical systems (MEMS)
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970109 Expanding Knowledge in Engineering
Identification Number or DOI: https://doi.org/10.1109/LED.2019.2899068
URI: http://eprints.usq.edu.au/id/eprint/38162

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