Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing

Dinh, Toan ORCID: https://orcid.org/0000-0002-7489-9640 and Nguyen, Tuan-Khoa and Phan, Hoang-Phuong and Nguyen, Quan and Han, Jisheng and Dimitrijev, Sima and Nguyen, Nam-Trung and Dao, Dzung Viet (2019) Thermoresistance of p-Type 4H–SiC Integrated MEMS Devices for High-Temperature Sensing. Advanced Engineering Materials, 21 (3):1801049. pp. 1-7. ISSN 1438-1656

[img]
Preview
Text (Accepted Version)
Manuscript_revision.pdf

Download (991kB) | Preview

Abstract

There is an increasing demand for the development and integration of multifunctional sensing modules into power electronic devices that can operate in high temperature environments. Here, the authors demonstrate the tunable thermoresistance of p‐type 4H–SiC for a wide temperature range from the room temperature to above 800 K with integrated flow sensing functionality into a single power electronic chip. The electrical resistance of p‐type 4H–SiC is found to exponentially decrease with increasing temperature to a threshold temperature of 536 K. The temperature coefficient of resistance (TCR) shows a large and negative value from −2100 to −7600 ppm K−1, corresponding to a thermal index of 625 K. From the threshold temperature of 536–846 K, the electrical resistance shows excellent linearity with a positive TCR value of 900 ppm K−1. The authors successfully demonstrate the integration of p–4H–SiC flow sensing functionality with a high sensitivity of 1.035 μA(m s−1)−0.5 mW−1. These insights in the electrical transport of p–4H–SiC aid to improve the performance of p–4H–SiC integrated temperature and flow sensing systems, as well as the design consideration and integration of thermal sensors into 4H–SiC power electronic systems operating at high temperatures of up to 846 K.


Statistics for USQ ePrint 37744
Statistics for this ePrint Item
Item Type: Article (Commonwealth Reporting Category C)
Refereed: Yes
Item Status: Live Archive
Additional Information: Accepted version deposited in accordance with the copyright policy of the publisher.
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Faculty/School / Institute/Centre: Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 Jul 2013 -)
Date Deposited: 30 Jan 2020 06:49
Last Modified: 27 May 2021 05:50
Uncontrolled Keywords: high temperatures; MEMS sensors; silicon carbide; thermoresistance
Fields of Research (2008): 09 Engineering > 0912 Materials Engineering > 091299 Materials Engineering not elsewhere classified
02 Physical Sciences > 0204 Condensed Matter Physics > 020499 Condensed Matter Physics not elsewhere classified
Socio-Economic Objectives (2008): E Expanding Knowledge > 97 Expanding Knowledge > 970102 Expanding Knowledge in the Physical Sciences
Identification Number or DOI: https://doi.org/10.1002/adem.201801049
URI: http://eprints.usq.edu.au/id/eprint/37744

Actions (login required)

View Item Archive Repository Staff Only