Li, L. F. and Cheng, Y. K. and Xu, G. L. and Wang, E. Z. and Zhang, Z. H. and Wang, H. (2014) Effects of indium addition on properties and wettability of Sn–0.7Cu–0.2Ni lead-free solders. Materials and Design, 64. pp. 15-20. ISSN 0264-1275
Abstract
This paper reports the investigation on indium addition into Sn–0.7Cu–0.2Ni lead-free solder to improve its various performances. The effects of indium addition on melting temperature, coefficient of thermal expansion (CTE), wettability, corrosion resistance and hardness of the solder alloys were studied. The results showed that when the addition of indium was ⩽0.3 wt.%, the change in melting temperature of Sn–0.7Cu–0.2Ni–xIn solders was negligible, but the melting range of the solder alloy increased. The CTE and spreading area of Sn–0.7Cu–0.2Ni–xIn solders on copper both increased with the addition of indium. An optimal CTE was 17.5 × 10−6/°C by adding 0.3 wt.% indium. At this concentration, the spreading area of solder on copper was about 15.6% larger than that of Sn–0.7Cu–0.2Ni indium-free solder. The corrosion resistance also increased with the addition of indium increasing, and the corrosion rate of Sn–0.7Cu–0.2Ni–0.3In solder was reduced by 32.8% compared with Sn–0.7Cu–0.2Ni alloy after 14 days in 5% hydrochloric acid solution at room temperature. However, a decrease of 11.7% in hardness of the solder was found when 0.3 wt.% indium was added.
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| Item Type: | Article (Commonwealth Reporting Category C) |
|---|---|
| Refereed: | Yes |
| Item Status: | Live Archive |
| Additional Information: | Permanent restricted access to published version due to publisher copyright policy. |
| Faculty/School / Institute/Centre: | Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 July 2013 -) |
| Faculty/School / Institute/Centre: | Current - Faculty of Health, Engineering and Sciences - School of Mechanical and Electrical Engineering (1 July 2013 -) |
| Date Deposited: | 14 Feb 2015 12:45 |
| Last Modified: | 06 Apr 2017 06:41 |
| Uncontrolled Keywords: | lead-free solder; melting property; wettability; mechanical properties |
| Fields of Research (2008): | 09 Engineering > 0905 Civil Engineering > 090503 Construction Materials 03 Chemical Sciences > 0306 Physical Chemistry (incl. Structural) > 030602 Chemical Thermodynamics and Energetics 09 Engineering > 0912 Materials Engineering > 091207 Metals and Alloy Materials |
| Socio-Economic Objectives (2008): | B Economic Development > 86 Manufacturing > 8611 Basic Metal Products (incl. Smelting, Rolling, Drawing and Extruding) > 861199 Basic Metal Products (incl. Smelting, Rolling, Drawing and Extruding) not elsewhere classified |
| Identification Number or DOI: | 10.1016/j.matdes.2014.07.035 |
| URI: | http://eprints.usq.edu.au/id/eprint/26041 |
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