A pilot study on the relationship between mechanical and electrical loss tangents of glass powder reinforced epoxy composites post-cured in microwaves

Ku, H. and Wong, P. and Maxwell, A. and Huang, J. and Fung, H. and Mohan, T. (2011) A pilot study on the relationship between mechanical and electrical loss tangents of glass powder reinforced epoxy composites post-cured in microwaves. In: ICKEM 2011: 1st International Conference on Key Engineering Materials, 25-27 Mar 2011, Sanya, China.

Text (Accepted Version)

Download (638Kb)


The mechanical and thermal properties of hollow glass powder reinforced epoxy resin composites have been measured and evaluated in earlier studies. This basic but critical and important data have caused interests in the relevant industry in Australia. This study is therefore carried out to measure and evaluate the dielectric properties of the composites with a view to benefit the relevant industry. The relationship between the dielectric and thermal properties will also be studied and correlated. The original contributions of this paper are that samples post-cured in conventional ovens have higher electrical as well as mechanical loss tangent values than their counterparts cured in microwaves only. The storage modulus of all samples post-cured conventionally is higher than its counterpart. This is in line with the fact that they are softer material with lower glass transition temperatures. For all percentages by weight of glass powder, the glass transition temperature for the microwave cured sample was higher and the composite was stiffer; the opposite was true for the conventionally cured samples.

Statistics for USQ ePrint 18790
Statistics for this ePrint Item
Item Type: Conference or Workshop Item (Commonwealth Reporting Category E) (Paper)
Refereed: Yes
Item Status: Live Archive
Additional Information: Accepted version deposited in accordance with the copyright policy of the publisher.
Faculty/School / Institute/Centre: Historic - Faculty of Engineering and Surveying - Department of Mechanical and Mechatronic Engineering
Date Deposited: 30 Mar 2011 07:03
Last Modified: 28 Sep 2017 04:12
Uncontrolled Keywords: epoxy resin hollow glass powder; dielectric loss tangent; mechanical loss tangent; glass transition temperature; storage modulus
Fields of Research : 09 Engineering > 0912 Materials Engineering > 091299 Materials Engineering not elsewhere classified
09 Engineering > 0915 Interdisciplinary Engineering > 091505 Heat and Mass Transfer Operations
09 Engineering > 0912 Materials Engineering > 091209 Polymers and Plastics
Socio-Economic Objective: B Economic Development > 86 Manufacturing > 8699 Other Manufacturing > 869999 Manufacturing not elsewhere classified
Identification Number or DOI: 10.4028/www.scientific.net/AMR.214.26
URI: http://eprints.usq.edu.au/id/eprint/18790

Actions (login required)

View Item Archive Repository Staff Only