Relationship between electrical and mechanical loss tangents of SLG reinforced phenolic composites: pilot study

Abstract

The mechanical properties of ceramic microspheres (SLG) reinforced phenolic resin composites have been measured and evaluated in earlier studies. This basic but critical and important data have caused interests in the relevant industry in Australia. This study is therefore carried out to measure and evaluate the dielectric and mechanical properties of the composites with a view to benefit the relevant industry. The relationship between the two properties will also be studied. The original contributions of this paper are that samples post-cured in conventional ovens have higher electrical loss as well as mechanical loss than their counterparts post-cured in microwaves. The storage modulus of all samples post-cured conventionally is higher than its counterpart. This is in line with the fact that it is a softer material with lower glass transition temperature. They also have higher mechanical loss tangent as well as loss modulus. For all percentages by weight of SLG, the glass transition temperature for the microwave cured sample was higher and the composite was stiffer; the opposite was true for the conventionally cured sample.