Cardona, Francisco and Ku, Harry S. and Pattarachaiyakoop, Noppadon and Rogers, David and Trada, Mohan (2007) Fracture toughness of phenol formaldehyde composites post-cured in microwaves. Journal of Electromagnetic Waves and Applications, 21 (14). pp. 2137-2146. ISSN 0920-5071
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Official URL: http://www.ingentaconnect.com/content/vsp/jew
Identification Number or DOI: Doi: 10.1163/156939307783152867
Abstract
[Abstract]: A commercial phenol formaldehyde based resole thermosetting resin supplied by Borden Chemical Australia Pty. was filled with ceramic-based fillers (Envirospheres “SLG”) to increase its fracture toughness. By testing fracture toughness at a range of filler addition levels, the optimal addition level of SLG was able to be determined in terms of workability, cost and performance. The composites obtained were post-cured in conventional oven and in microwaves respectively. It was found that the fracture toughness of the microwave cured composites were up to 37 % higher than those cured in conventional oven when the percentage by weight of SLG varies from 0 to 35%. The time required for post-curing was also reduced from 10 hours (in conventional oven) to 40 minutes (in microwaves).
| Item Type: | Article (Commonwealth Reporting Category C) |
|---|---|
| Additional Information: | Reproduced in accordance with the copyright policy of the publisher. This item will be freely available at the link above. |
| Uncontrolled Keywords: | Phenol formaldehyde, phenolic resin, microwaves, envirospheres, SLG, short bar test, viscosity |
| Fields of Research (FOR2008): | 09 Engineering > 0912 Materials Engineering > 091202 Composite and Hybrid Materials 09 Engineering > 0912 Materials Engineering > 091209 Polymers and Plastics |
| Subjects: | 290000 Engineering and Technology > 291400 Materials Engineering |
| Socio-Economic Objective (SEO2008): | UNSPECIFIED |
| ID Code: | 3011 |
| Deposited By: | |
| Deposited On: | 11 Oct 2007 11:18 |
| Last Modified: | 16 Mar 2010 12:57 |
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