Yao, X. and Wang, H. (2006) Modeling of semisolid structure formation in controlled nucleation method. International Journal of Modern Physics B, 20 (25-27). pp. 4123-4128. ISSN 0217-9792
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Abstract
Modeling the semisolid structure formation is of significance in both understanding the mechanisms of the formation of such structure and optimization the solidification conditions for the required structure. A modified cellular automaton (mCA) model has been developed, which is coupled with macroscopic models for heat transfer calculation and microscopic models for nucleation and grain growth. The mCA model is applied to Al-Si alloys, one of the most widely used semisolid alloys. It predicts microstructure morphology and grain size during semi-solid solidification, and determines the effects of poring temperature and mould temperature on the final microstructure. The simulated results are compared with those obtained experimentally. The resulting simulations give some insight into the mechanisms about the semisolid structure formation in Controlled Nucleation process
| Item Type: | Article (Commonwealth Reporting Category C) |
|---|---|
| Additional Information: | Author's version deposited in accordance with the copyright policy of the publisher. Preprint of an article submitted for consideration in International Journal of Modern Physics B: Condensed Matter Physics; Statistical Physics; Applied Physics © 2006 copyright World Scientific Publishing Company http://ezproxy.usq.edu.au/login?url=http://search.ebscohost.com/login.aspx?direct=true&db=aph&jid=8K0&site=ehost-live |
| Uncontrolled Keywords: | microstructure modeling, semisolid metal processing, semisolid structure formation, Al-Si alloy |
| Fields of Research (FOR2008): | 09 Engineering > 0912 Materials Engineering > 091202 Composite and Hybrid Materials 09 Engineering > 0912 Materials Engineering > 091207 Metals and Alloy Materials |
| Subjects: | 290000 Engineering and Technology > 291400 Materials Engineering |
| Socio-Economic Objective (SEO2008): | UNSPECIFIED |
| ID Code: | 2220 |
| Deposited By: | |
| Deposited On: | 16 Nov 2007 11:35 |
| Last Modified: | 16 Dec 2011 11:18 |
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